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BrightSpots 3D IC Panel - Part 3: Thin-wafer Handling Temporary Bonding/Debonding

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Uploaded by on Jul 19, 2009

Part 3 of the BrightSpots 3D IC Panel features one of the hottest topics of the discussion -- thin-wafer handling and the temporary bonding and debonding process. EV Group's executive technology director, Paul Lindner offers his viewpoints on the role of wafer bonding and thin-wafer handling with Bob Patti, CTO of Tezzaron, chiming in from the manufacturing side. You can share your viewpoints or simply monitor discussions at www.semineedle.com/MCA3DIC. For more information, visit www.mcapr.com.

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