Automated Sub-Micron Die Bonder - FINEPLACER® femto - Finetech

The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applications.

This award winning system offers modular application architecture and can be flexibly equipped for a wide range of applications and processes. It is an ideal system for a production environment as well as for product and process development, accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification.

Category:

Science & Technology

Tags:

• Die Bonder
• Flip Chip Bonder
• opto
• packaging
• on wafer assembly
• laser bonding