Laser Depaneling of Assembled PCBs

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Uploaded by on Jun 14, 2010

The LPKF MicroLine 6000 S is ideal for clean and particulate-free separation of single boards from a larger panel of flexible, thin rigid and rigid-flexible PCB materials. More information:http://www.lpkf.com/products/pcb-processing/index.htm?utm_source=you­tube.com&utm_medium=Social%2BMedia&utm_campaign=PCB-Processing%2BVideos

It also cuts in PI, FR4, FR5, and CEM materials. Further materials include polyesters, ceramics and other RF-materials. The laser cuts virtually any shape with minimal spaces between the single PCBs. The system features a clearance between the laser head and the working area surface of 30 mm, on a large area of 610 x 457 mm (24 x 18). This allows for processing populated PCBs with surface mount devices (SMD) on both sides.

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