Alert icon
We're changing our privacy policy. This stuff matters.  Learn more  Dismiss

BrightSpots 3D IC Panel - Part 2: Wire Bonding vs. TSVs and Design Tools for 3D

Loading...

Sign in or sign up now!
Alert icon
Upgrade to the latest Flash Player for improved playback performance. Upgrade now or more info.
642 views
Loading...
Alert icon
Sign in or sign up now!
Alert icon

Uploaded by on Jul 19, 2009

Part 2 of the BrightSpots 3D IC panel delves into wire bonding vs. TSVs weighing form factor, cost and performance gains. Conversation also turns to what's going on with design tools for 3D. You can share your viewpoints or simply monitor discussions at www.semineedle.com/MCA3DIC. For more information, visit www.mcapr.com.

  • likes, 0 dislikes

Link to this comment:

Share to:
see all

All Comments (0)

Sign In or Sign Up now to post a comment!
Loading...

Alert icon
0 / 00Unsaved Playlist Return to active list
    1. Your queue is empty. Add videos to your queue using this button:
      or sign in to load a different list.
    Loading...Loading...Saving...
    • Clear all videos from this list
    • Learn more