Drying/baking ovens; vacuum sealing; Humidity control cabinets: All available to ensure your products have little or no damaging moisture content. Humidity control down to 1%Rh guarantees that your substrate material will not de-laminate when reflow soldering. Probably the single biggest cause of product failure after and during reflow whether at production stage or rework. Moisture is a killer and baking it out or ensuring it doesn't get in is essential. Please visit our website at www.blundell.co.uk.
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