Nepes Private Limited - Flip Chip Bumping

Nepes Pte., Ltd. is the first 12-inch wafer bumping foundry that has advanced into Singapore. It concentrates its efforts on solder bumping of high-tech semiconductors, such as graphics and mobile chipsets. It started its business on the basis of the patent for the solder bumping independently developed by its parent company, Nepes Corp. Semiconductors made by fab-less companies, such as NVDIA, Broadcom, Xilinx and Qualcomm, employ solder (high lead, eutectic and lead-free), gold and copper pillar bump.

Nepes Pte., Ltd. is aiming to be a global leading company in Flip Chip bumping Packaging business, established in 2005 and dedicated to provide the service to link wafer foundries and backend packaging companies in Singapore.

As a major shareholder, NEPES Corp. (www.nepes.co.kr) who is established in 1990 and sole flip chip packaging foundry in Korea has transferred whole technology and know-how related to flip chip since it started semi-conductor business in 2000.

For more information, visit us at www.nepes.com.sg

Category:

Science & Technology

Tags:

• wafer
• semiconductor
• bumping
• business
• nepes