BGA reworking without special reballing equippment
Uploader Comments (LoMe64)
All Comments (263)
-
Yes, and there's also the fact that the foil is easier to use when desoldering than when resoldering. In the latter the added protection might not be worth risking misplacement of chip and stuff.
Impressive work. I know my SMD work so of course I knew this is possible. But only now I believe this can be practical.
-
Hi!
Danke für die Blumen.
Die Temperatur ist deshalb so hoch, um die Dauer möglichst klein zu halten. Das ist dann von Vorteil, wenn sich in unmittelbarer Nähe des Chips empfindliche Bauteile befinden (z.B. aus Kunststoff). Meiner Erfahrung nach leiden die weniger bei kurzer Lötdauer mit höherer Temperatur.
Wenn der CNC Dispenser fertig ist UNBEDINGT ein Video einstellen! Interessiert mich sehr! Lothar
-
Immerwieder eindrucksvoll ;) Aber waum so heiß? Bei mir klappt alles (auch ROHS) zwischen 220-230°
Aber habe was anderes vor:
Ich hab mir doch ne kleine CNC gebaut (video in meinen channel)
Da schnall ich mir einen Lötpasten Dispenser drauf der mir das macht ;)
Ich möchte mich ja auf CPUs, GPUs und Chipsätze "spezialisieren", und 400-800 balls drauf machen mit der hand..... ich weiß nicht ob das so toll ist ;)
Hi great work. What type of flux and what is the solder you used ? Thanks
michaeld4500 1 month ago
@michaeld4500
Thank you.
Concerning flux and solder, please read the older comments.
It's discussed more than once there.
Lothar
LoMe64 1 month ago
Awesome. Wow. I don't think I would have the patience to do this. Love the music too.
trueblu8 2 months ago
@trueblu8
Thank you for the kind words! Lothar
LoMe64 2 months ago
Hmmmm why did you cover it with foil when heating the first time but did not cover it when heating the chip back...? Is the foil even needed.
YouStubid 2 months ago
@YouStubid
I already answered this question in the comments.
It's not "needed", but prevents sensitive parts (plastic) from being damaged.
During the desoldering process more heat is applied for a longer time than during resoldering. Therefore protection is needed during desolderding rather than during resoldering.
LoMe64 2 months ago