BGA rework by hand
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Uploaded by ppkerobotics on Jun 21, 2008
:)
Uploader Comments (ppkerobotics)
All Comments (34)
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no EPA protection what so ever. y e p f i x t h a t g o o d : )
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ASSEMBLED IN CHINA :P
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How much would it cost to fix, because I have the same problem on HP 6735s laptop
Thanks
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This can cause permanent damage to the chip. You are not using a thermal profile. You can blister and delaminate the chip/board.
If you are going to reflow chips, do it right, but stop giving people bad advice.
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Thanks for the obnoxious song instead of letting us hear what hes saying. SOOO MUCH BETTER AND NOTHING LIKE IT ON YOUTUBE BEFORE!
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A few basic questions:
1. How many IC reflows have you done using this technique, and
2. What is your success rate
I do 20 to 30 a week, with a success rate b/n 92% - 96% with 6 months warranty.
If a job is returned between 1 week to 2 months, I class it as temporary or not successful
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I do 20 to 30 a week, with a success rate b/n 92% - 96% with 6 months warranty.
If a job is returned between 1 week to 2 months, I class it as temporary or not successful
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Nice cooling system. How much did that cost?
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sweet, lets just let everyone touch my south bridge while its getting reworked.
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May I know in the first place how do u know it is the South Bridge is the one at fault?
why didn't you suspect the vga chip?
leboch65 1 year ago
@leboch65 First we expected that the VGA chip causing this problem but further memory and PCI lane traffic tests showed that only one bit is toggling unexpectedly on data path which also caused recognizable error patterns on screen. Bit error simply disappeared when we pushed the south bridge with a small pressure.
ppkerobotics 1 year ago
please tell me the name of Thermic camera? what model and how much does it cost?
dancdt 2 years ago
It is a FLIR SYSTEMS Thermovision A20
ppkerobotics 2 years ago
What was the max temperature acheived?
Was the solder lead free?
protonus 3 years ago
Since today's laptops are made with RoHS compliant manufacturing
process we had to use higher temperature to melt the lead free solder,
therefore 220°C should be achieved to ensure that BGA balls are
melted. With soldering flame we could do this according to results can
be seen on this video.
ppkerobotics 3 years ago