Laser Soldering - CFD Simulation Results

http://cmrg.gre.ac.uk/ For sensitive optoelectronic components, traditional soldering techniques cannot be used because of their inherent sensitivity to thermal stresses. One such component is the fourteen lead optoelectronic butterfly package which houses a laser diode chip aligned to a fibre pigtail. Even sub-micron misalignment of the fibre and laser diode can result in signal losses, significantly reducing the performance of the device. The high cost of each unit requires that damaged to the components via the laser soldering process does not occur.

Mathematical modelling is undertaken to better understand the laser soldering process and to optimize operational parameters such as: laser scanning speed; total lasing time; maximum surface temperature; solder paste volume; Copper pad dimensions; laser intensity.

Category:

Science & Technology

Tags:

• optoelectronic
• soldering
• laser
• CFD
• simulation
• results
• thermal
• butterfly
• package
• fibre
• pigtail
• modelling