LISA09 LastDay Plenary part 1 Bruno Michel of IBM Zurich Research Laboratory

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Uploaded by on Nov 7, 2009

This is not part 4, was actually very early in Bruno's talk. He explained thermal packaging, radiance in chips, temperature differentials, cutting very small channels into heat syncs. He said that a 2g transistor, 10microns thick, takes 2kg of coolers. That's a million times ratio of mass to thermal management! My apologies to you scientists, please feel free to correct my shorthand on measurements or properness or really anything. I love science, but I'm not a scientist.

Presentation slides are available at http://www.usenix.org/events/lisa09/tech/slides/michel.pdf.

Please note that the proper professionally-recorded videos are available on the USENIX web site if you are a USENIX member you have access. If you're not a member, JOIN! Good quality video at http://www.usenix.org/multimedia/lisa09michel.

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