This is a technical session on the role of solder paste and the interaction with SMT stencils, squeegees and other tools as paste is printed onto the PCB. Rheology, paste behaviour and rules of thumb for printing are highlighted in this session. This is Part 1 of 6 of a session which is from the BEST SMT Paste Printing Symposium held in Chicago in 2011. www.solder.net
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