Alert icon
We're changing our privacy policy. This stuff matters.  Learn more  Dismiss

Real-time x-ray 3D inspection of bga ic and pcb - part 2

Loading...

Sign in or sign up now!
Alert icon
Upgrade to the latest Flash Player for improved playback performance. Upgrade now or more info.
2,922
Loading...
Alert icon
Sign in or sign up now!
Alert icon

Uploaded by on May 3, 2010

BGA inspection (Ball Grid Array Inspection) is necessary to detect and isolate process defects between a chip and circuit board. BGA inspection looks for a variety of ball grid array problems during process development or the quality process.

Both BGA inspection look for a variety of defects during process development or the quality process, including:

- Cracked Solder Joints
- Excess Flux
- BGA Separation
- Bridging
- Cold Solder Joints
- Solder Pads
- Contamination
- Empty and Open
- Improper Solder Paste Replacement
- Joint Cracking
- Ratcheting
- Non-Contact

Category:

Education

Tags:

License:

Standard YouTube License

  • likes, 0 dislikes

Link to this comment:

Share to:
see all

All Comments (0)

Sign In or Sign Up now to post a comment!
Loading...

Alert icon
0 / 00Unsaved Playlist Return to active list
    1. Your queue is empty. Add videos to your queue using this button:
      or sign in to load a different list.
    Loading...Loading...Saving...
    • Clear all videos from this list
    • Learn more