BGA inspection (Ball Grid Array Inspection) is necessary to detect and isolate process defects between a chip and circuit board. BGA inspection looks for a variety of ball grid array problems during process development or the quality process.
Both BGA inspection look for a variety of defects during process development or the quality process, including:
- Cracked Solder Joints
- Excess Flux
- BGA Separation
- Bridging
- Cold Solder Joints
- Solder Pads
- Contamination
- Empty and Open
- Improper Solder Paste Replacement
- Joint Cracking
- Ratcheting
- Non-Contact
Link to this comment:
All Comments (0)