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A64 3500+ processor lapping. Xp120 lapping

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Uploaded by on Apr 12, 2007

I just lapped my processor and cooler base.

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Sports

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Standard YouTube License

  • likes, 10 dislikes

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Uploader Comments (SiB77)

  • were the cpu and heatsink surfaces dry? or you used some water to improve results? :)

  • On the video both are as dry and clean as possible.

  • did u need the thermal stuff slap on it or not?

  • I did not use thermal paste for video. Surfaces are very flat so even air can´t get between for 7 seconds. When I assembled cpu and cooler I did use thermal paste, but amount was barely visible. Got my cpu temperature down by 10-15 celsius.

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All Comments (39)

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  • ITS SO SHINY!

  • Did you lap the Noctua heatsink? Or was it flat enough?

  • actually putting too much paste can raise temps.

    lol 1 year later :P

  • @sho.

    The better the lap the less paste you need. Thats how it works. The best possible thermal transfer would be a 100% (physically impossible but you can get close) perfect connection between the two plates. Rendering thermal paste useless.

    The idea of thermal paste is to eliminate the microscopic air pockets and imperfections between the two plates. The smoother the plate, the less you need.

    More thermal paste will not make the thermal transfer better, it will make it worse.

  • I know I'm a bit late but, usually when people report a very large drop in temperatures after lapping, it will be because of a concave/convex IHS or heatsink base or both, so in some circumstances when you do have a convex/concave IHS it makes perfect sense to lap the hell out of it to get a flat surface, this is the true goal of lapping, NOT to produce a shiny surface but to produce a FLAT one.

  • Some people go even higher. I go from 400 to 2500 to 10 micron ;)

  • Idk... it sounds right in theory

    All I know is that CPU temps drop a few degrees when it's lapped.

    The more direct contact on the HS to CPU is best - I guess less paste = less resistance

  • thats exactly it... you CAN scale it down. But when you have enough paste to not scale it down.. then why bother scaling down?Wont a lapped up surface+regular amount of paste work better than a lapped up surface+scaled down amount of paste? I dont get it...the reason for lapping is to improve the transfer of heat..when you improve one area why regress another area?

  • All the paste does is fill in the imperfections and scratches on the heatsink and processor.

    The smoother they are, the fewer imperfections they will have.

    Therefore, you can scale down on the amount of paste.

  • which leads me to my question number two.. why in the world would someone want to use less paste? even if you do lap it, wont NOT drastically reducing paste further increase the effects? dont tell me paste is too expensive O_O

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