3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors

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Uploaded by on Sep 7, 2011

Innovation leading to the creation of 'Silicon Skyscrapers'

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." The companies are aiming to create a new class of materials, which will make it possible to build, for the first time, commercial microprocessors composed of layers of up to 100 separate chips. Watch the video to see how the process will work!

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  • @HyperColours

    1,000 times faster in a similar area is a 'band aid'?

  • We already know that there has to be a new leap in understand to make computers faster by making them more efficient.

    This is just a band aid to make a chunky processor.

  • Nareszcie się coś ruszyło. ;D

    Hip, Hip, Huraaaaa

  • Superp

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