TEPLAAMERICA's Channel - YouTube

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Wafer Processing - Stress Relief of Wafer Back-Side

The process of wafer back-grinding induces stress that can propagate into the bulk of the wafer causing it weaken. This weakening effect of the waf...

pvateplaamerica • 8,380 views

TEPLAAMERICA commented:

Yes, the wafer was polished after a backgrind.

About TEPLAAMERICA's channel

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TEPLAAMERICA

Latest Activity

Jan 4, 2012

Date Joined

Jan 4, 2012

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Age

43

Country

United States

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