Added: 1 year ago
From: CosplayerTheRealLink
Views: 2,087
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  • Thanks to those commenting about my TIM placement. I have since reapplied the compound with small dabs in the center and let the weight form the pattern / contact points. Good point to make just the same though, thanks!

  • Also MX-4, or IC Diamond 24 is some pretty good TIM. ;)

  • Err... So many mistakes. I just like to clarify that *most* of the heat is in the middle anyways, where the cores are.

  • The patience and work into the videos IS admirable. Excuse me. :D

  • And spreading TIM causes a chance for air bubbles almost indefinitely. Let the heatsinks weight spread the TIM for you, this will make an air bubble free bond.

  • Even though this is an some what old vid, it is nice and the patience and work into the videos in admirable. But one thing to note: Dude you do not need that much thermal compound, lol. You put an almost peanut sized amount on the Xeon CPU AND you put more on the heatsink? You can put thermal compound on either heatsink, or CPU, which most just put on the CPU, but you don't put on both. Also keep the TIM in the middle and let the heatsinks weight spread it out, cause heat is only in the middle.

  • Thanks for the video keep looking at getting this mobo and have wanted a 2 cpu set up for close to 20 years now and this one maybe the one but cost is a factor. But do have the OS for it with win 7 ultimate . For Folding at home this would be one nice setup.

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