3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors

[THEGAMINGRULER]

@KlingonSpider why do you care no AMD and all these big companies all want money

[dosskull]

READY TO BUILD FLYING SAUCER AND GUNDAM ?

[ernis1100]

Well finally I had this idea for a long time.

[johnmt025]

wow gluing processors together, I could have told them that...

[PirateMcSandwich]

good luck cooling that

[Bfheroesmaniac]

GIMME NAO!

[kai23430]

I I3 M

[ThePunisherNWO]

AMD - ADD MORE CORES HURR HURR

IBM - ADD MORE LAYERS HERP DERP

INTEL - ADD MORE CHIPSETS

[tornadomannen2]

Price ?

[waseem1173]

you'd need a monstrous cooling system for this i reckon lol

[Tektechno]

more renderpower !!!!!!!

[m4rx05]

So does that mean 100 times the cost? :P

[luisces]

@m4rx05 No my friend, the question is " Does that mean 100 times the heat? "

Be ready for some buuuurning!

[01248163264128256512]

@luisces yep, can only imagine the temperatures inside those intermediate layers. 1000x faster... from zero to charcoal lol :p

[youssef0eddoumali]

but this is not the 1st april

[bgrgyk]

finally a 3D chip. I always imagined it as a cube with many capillaries inside for cooling liquid, but this will do

[sangolt88]

Xzibit would have fainted.

[glukaschlok]

Too bad 99.9999% of "tech breakthroughs" are just research firms exaggerating for funds.

[lynx821]

@glukaschlok Too good that IBM and 3M are actually developing and sooner or later, will produce this chip.

[StevenJTMarsh]

Memory is the current bottleneck of the von Neumann, so on-package RAM is likely to be the first application of this rather than 1,000 cores.

Of course, you will still have to deal with heat dissipation and power consumption - so don't expect this in your mobile phones until fabrication technology moves on...

[dilibau]

1000 times the processing power of today's chips? You mean we'd all have our supercomputer right in our poket? Count me in ...

[xuancuong8x]

The new chip would consume 1000 times more power and produce 1000 times more heat, right?

[AndGoProductions]

ITS OVER 9000!!!

[AngryC4t]

MOAR CORES

[tutankhamunattack]

@AngryC4t MOAR COARS + MOAR'S LOAR = 2000 times faster

[Biko357]

a 5000$ CPU :D

[RCaIabraro]

I wanted to be the first jerk to "dislike" this.

[tintin1tintin]

This brick CPU is the beginning of T800 brain chip.

[tyroxis]

gonna need more arctic 5. MORE MORE MORE. 

[tyroxis]

gonna need more arctic 5. MORE MORE MORE. 

[fidelityeastpub]

Like so many others, I've used both AMD and Intel processors in various rigs and had only one problem with an Intel quad core, but it wasn't the chip's fault, it was mine. Dust, heat, shutdown. They're both good chips, but I'll have to go with AMD only because their subsidiary, Global Foundries, is building a giant manufacturing plant right near me in Upstate, New York. I'll support any business that has the guts (or stupidity) to do business in the People's Republic of New York.

[N00bGeek95]

I was wondering about the power consumption.

[RobCardIV]

100 layers = 100 times power consumtion? x 1 trillion devices?

Pow , Oww.

But serious.

get the FK on it and make it happen already.

[BAXFAXTER]

мне интересно ,как они охлаждать собрались этот пирог ?)

[MrJufri90]

but will it blend

[sherryssj5]

AMD better get added on the discussion. I prefer their products, which are reliable, and come for a fraction of the cost. The rumours against it are baseless.

[dingumfCallofDuty]

AMD: ADD MORE CORES

IBM: ADD MORE LAYERS

INTEL: ADD MORE DIMENSIONS

[komiradTV]

@dingumfCallofDuty AMD+IBM+INTEL = Captain Planet

[gaynm]

@dingumfCallofDuty lol to the cores |:P

[KlingonSpider]

IBM and 3M better not leave out AMD on this one. I hate seeing AMD left in the cold all the time. Intel has repeatedly bribed companies to not use AMD based devices, such as dell and sony. I always look out for the underdog and AMD is being targeted all the time. poor little ol' amd :(

[Shitsocash]

@KlingonSpider

Who gives a crap? like with anything else, just to spite them a year later AMD will come up with a comparable product developed in-house for a fraction of the price.

[Fiends4]

@KlingonSpider It's because AMD sucks. They are left behind because they allow themselves to be left behind.

[LucianHalo]

@Fiends4 I'm sure all the people who thumbed him up use AMD :P

[Jijheoo]

@KlingonSpider Imagine what all 3 companies could produce if they put their efforts and experience together.

[GigZ333]

@Jijheoo Something fantastic for the world, but alas it is not the case :(

[FieserxFettsack]

@Jijheoo This would happend if we have a Resource Based Economy ... !

[frvfilms]

hope to see this dream become reality , some day

[Code1967]

It be nice to use it to make jobs in America !!

[lasterdayfilms]

one day a guy from 3m called the ibm guy and was like hey i have a new glue check it out then they had dinner and made this video

[595o]

Is the adhesive isolating and if so then where will the layers be connected? Or is it letting through electric current but only in a certain way (at certain positions or only very directed)?

[KlingonSpider]

@595o they will probably be connected on the sides of the chips. like an elevator going from the bottom all the way up and stopping at each chip to connect.

[th3b0y]

That sounds amazing. I'm waiting! I hope I can work at IBM someday. =)

[SkaramandraX]

IBM will conquer the world...once again.

[bot0016]

it will melt.

[Racer020975]

This in Playstation 4

[xalentcash]

@Racer020975 Hahaha that made me laugh. Thumbs up.

[kapsethi]

@x86op - IBM has found new love in water based cooling tech. Recent mainframes come with sophisticated plumbing & water chillers.

[nach0x]

for some reason remember Xzibit and Pimp my ride :P

[kapefort]

Maybe in 10 years we can see such ''all in one cpu''

[x86op]

Hmm... well there seems to be potential here, but also some physical limitations. One being, thermal insulation and dissipation. Today's single-layer silicon can waste 100W or more, and a large heat-sink is required for that. There's no way 100 layers could be used like this, and still remain cool. (A 10kW CPU? Air-cooling would simply be impractical, due to the size required. Plus, it would function equivalent to an electric space-heater, in terms of heat generated.)

[Jijheoo]

@x86op do you think they would publicize development for this kind of stuff without thinking ahead of those problems?

I agree with what you're saying,but obviously they have a solution.

[YTBYlover]

@x86op relax, IBM knows what there doing. Have a little faith will you. You havn't even hard about their PSU or cooling plans as of yet.

Give it time.

[Arachnivore]

@x86op IBM has done a lot of research into integrating heat pumps directly onto a chip, I'm sure that will come in handy. They've also announced artificial neural network (ANN) chips that mimic biological systems. ANNs can have incredibly low power requirements for the tasks they perform, but they require massive connectivity (the kind that a 3D substrate can facilitate). Your brain can out perform a soccer-field sized super computer (in some tasks), yet it runs at 30 Watts. That may be the goal

[595o]

@Arachnivore Heat pump? You surely meant compressor cooling, right?

[MySchizoBuddy]

@x86op the X86 single silicon layer wastes 100W or more. why did you assume this is x86 architecture?

[595o]

@MySchizoBuddy Microcode is microcode, while the architecture makes some difference it won't be that much.

[x86op]

@MySchizoBuddy Well it could be RISC, but then you're talking 4x the code throughput necessary to achieve the same thing that a CISC (x86) accomplishes. Any way it's sliced, thermal efficiency of today's processors isn't spectacular. I just feel something major is going to have to happen to keep something like this cool enough to be practical.