Since Youtube isn't allowing us to post email or links in comments, please visit our website and go to the Customer Service > North America page to contact Armand Barrios
Particles are measured via test wafers which are processed through the chamber after the PM, then run through a very precise laser scan which counts the particles on the wafer.
Particle measurement was very successful and was the main reason our procedure was performed as customer was having high particle issues using their previous procedure, which was wiping with IPA.
Also, after using our PM technique, they were able to improve MTBC from 75K wafers to 150K wafers.
Nice diamond pad work. I used to PM the process chambers and would hate having to triple glove at times.
Hughesburner 2 years ago
In soem fabs, the engineers are requsted that they can not sit on tool plateform for safe concern for both people and tool.
tensor168 2 years ago
The same procedure can be followed standing to the side of the chamber.
Please contact Armand Barrios, VP of Application Engineering , if you would like to schedule a demonstration.
FoamtecWCC 2 years ago
Since Youtube isn't allowing us to post email or links in comments, please visit our website and go to the Customer Service > North America page to contact Armand Barrios
FoamtecWCC 2 years ago
Great job!!
This video really shows some of the issues we see in the fab...
mrmondo48 2 years ago
How is particle measurement afterward?
BigDTinyE 2 years ago
Particles are measured via test wafers which are processed through the chamber after the PM, then run through a very precise laser scan which counts the particles on the wafer.
Particle measurement was very successful and was the main reason our procedure was performed as customer was having high particle issues using their previous procedure, which was wiping with IPA.
Also, after using our PM technique, they were able to improve MTBC from 75K wafers to 150K wafers.
Thanks for watching!
FoamtecWCC 2 years ago