A spread and having it just a LITTLE bit thicker towards the edges should fix what you showed in the picture. It would fill the microgaps at the edges but also have a thin nice coating at the center.
ur like, a genius. what do you think of instead of applying it in an x or cross or pea, what about if u applied it as a swirl that way when the heatsink rests on top, it spreads all over? recommended? yes? no? thanks for all your help
Also, why are you twisting.... you don't need to do that, and if anything it opens the door for uneven spreading and air bubbles or other mistakes... Just use a pea dot right in the center, and firmly place your heatsink down straight and neat. While securing it, you will move it slightly anyway and that will do the same effect you're doing anyway except not to the degree you're doing it.
The CHIP is right in the CENTER of the CPU, so the pea method is the ONLY method you should ever use. Spreading is retarded and prone to bubbles, mistakes, and makes a mess. Pea method spreads evenly and covers the most important part THE CENTER of the CPU where all the heat will be generated anyway. Don't be a fool, don't spread.
@summerville22432 This is about as accurate as I've seen aside from my own calculations. For a .003" (.076 mm) thick layer to be produced that covers most of the CPU cap, a sphere with a diameter of .204" (5.2 mm) needs to be applied to the center. I'm sure there are plenty of variables in there that I didn't account for, but I'm glad to know I got very close to IC's recommendation =)
@snipekill2445 I agree! I've used several different methods in applying thermal paste and I have found that a little paste right in the center of the cpu give you the best results.
I still prefer the dot method, and even then, with a small quantity oh high density compound, for no one here is considering the heat effect on density.
You fucked up the "high 5" method as you call it. Your center dot had way more than the others. If you use a normal amount in the center then it spreads just fine. 5 dot X works best.
@Nosoulnomore Oh duh, makes sense, I did end up buying a silver compound one so hopefully I'm safe, first time doing this. I've already cleaned out my heat-sink and used some Arctic Silver cpu cleaner / purifier and AS5 since my last comment. Temps dropped by 25-30C under load no wonder my system was crashing before when it was peaking at 75C. Couldn't really tell if I spilled any over the edges but hopefully the pea method doesn't come back to bite me :-P
The so called "hi five" method looks like some kind of alien sign! Haha! Lol! :p You know, like something taken out of an episode of X-Files! :) Like the pilot episode where these alien abducted teenagers would appear to have two small unidentified marks on their bodies. Hey how about that, a two pea method?!...
Haha! Omg! The smiley method is so funny! :) Watch his eyes and lips swell as the glass plate is pushed against his face! And then he just blows up! *Lolcat* Hilarious!
Nice vid. I have been practicing with different methods and settled with pea. Took some tries to know the proper quantity but well worth it. Was able to squeeze 2-3 degrees down at high load and am running e8500 at stable 3.8ghz with the stock intel cooler.
Plexiglass is being flexed into a concave shape, trapping air. If it was concave like you're image theory then it would push the air out of the spread method as it's being seated. That said, I'd still have to agree in principle that the pea method has less of a chance of trapping air. I think I'll stick w/ the method of a very thin layer (thinner than what was shown) w/ a pea drop center. It's worked very well for me.
@srwilli4m that's the problem. th ere is no right way, especially for playstation 3 owners doing this procedure. computers only radiate heat from the center of the chip, but the ps3 has components under all four corners as well, so all of these techniques fail it including the spread method
its better to use a cuetip and spread it everywhere on the cpu. in this video, all methods just connect the center of the cpu with the heatsink instead of connecting the complete cpu with it!
@budojon if u read the arctic silver instructions, that's what the manufacturer exactly recommends, no what you are suggesting. and cute-tip rubbing could create static while rubbing thermal compounds :)
Anything less than 100% coverage seems wrong. When I popped the heatsink off my Dell, it had 100% coverage with little overflow. Tell me how they did that and how I can do that and then you are getting somewhere useful.
@TheLarryBrown Read the description. He says it's not necessary to go for 100% coverage because most of the heat is focused on the center of the processor. Trying to do so would usually result in some air bubbles throughout the processor. Thus, the Pea method seems to be the best one.
This is a good video, the best I've seen on the subject, But I came here to learn "how to do it" and you didn't teach me that. No one on youtube seems to know how to do this properly. If you think you know, you should state up front what is the method you think should be used, then use the alternate methods to prove your point. Don't leave it up to us to make our own conclusions, you should tell us what you think.
Has anybody got any recommendations on which method to use for an AMD Athlon 64 X2 3800?
Also does it matter than not 100% of the CPU is covered?
When applying is it best to move the Heatsink (Coolermaster Hyper TX3 possibly) around like this person is to spread the thermal paste, or just attach it and it will happen?
That entirely depends on how big the sheet is, and how thick it is; ever tried snapping a very small twig before?
The plexiglass sheet is pretty small, and it looks extremely thick for something that big; It's doubtful that it'd be bending any more than the metal used on a heatsink.
If it is a dual or quad core CPU then each of the cores are hardly ever just in the centre they are spread out in the corners separated by the control transistors. This means that modern Dual and Quad core CPU's need more coverage further out from the centre.
@DuddBudda I twist my HSF, thought most people did....
Plexiglass bending will have a very small effect in this test (mostly due to the limited size, try it yourself) and if it did it would of affected the pea method the most which clearly won anyway.
@themassau Have you ever seen a CPU w/o a IHS on it? The core in the pea method is MORE than covered with tons of excess IHS area covered. If you look at a CPU w/o a intregrated heat sink or IHS...the core is tiny comapred to the IHS. The pea method is logically the best method for MX/AS3-4-5 series TIM's due do there being no air bubbles no excess TIM stuck between the IHS and the heatsink/waterblock because of the high viscosity.
i think pressure has alot to do also, i usually dont mash down on the chip i let the screws/ clamp do that cause you could apply too much pressure and get the dreaded air bubbles and excess paste coming out the side
So basically the pea method would appear to be best? It appears that all I have to do is take the heatsink off, clean off the old paste, reapply new paste via the pea method, and push the heatsink back on.
Correct me if I'm wrong, please, but it seems much simpler than I've made it out to be, haha.
Unfortunately, the pea method becomes less optimal as more cores start showing up underneath those heat-spreaders if you could tell exactly where each core is located underneath, you could apply a small pea over the location of each core for best heat transfer. I want Intel and AMD to introduce an outline around the location of each core on the heat-spreaders, that would be wonderful.
@WaWaWeeeeeeeWa In fact, this IS a very infomative video for PC techies like us. Unlike you whom doesn't know anything about PC maintainence...so stop trolling. Although I'm still at the amatuer level of PC maintainence, hence, that doesn't stop me from learning and doing basic overclocking on my own rig. Also that, I could earn a few bucks from friends and clients to keep up with my hobby.
Is there any way to combine methods? I like the pea/rice grain method but I don't like how the paste doesn't reach the corners and edges of the cpu...
@Intranetusa Pea/Rice grain methods are the best IMO. Bcoz the main core(s) are mainly located in the mid section of the cpu IHS.
Another way is to use a flexible plastic, like a credit card (preferably VISA or AMEX), to spread it over the entire IHS. Then using the heatsink of ur choice to apply some pressure (as shown in the vid) to get rid of unwanted air bubbles or pockets, b4 securing it. For HDT heatsinks, it's more or less the same.
Although I do know how to apply TP. I've just been always using the credit card method, but it seems there will always be bubbles it seems.
I think I'm going to use the pea/grain method, and combine it with the 5 finger method in order to reach the corners too. Basically a large dollop in the middle and 4 smaller dollops on the corner.
@Intranetusa Both will create tiny air pockets unless u apply some pressure downwards on the heatsink by twisting it left and right b4 clamping it down. This to unsure that 99% of the air pockets between both metals are pushed out. Anyway, this is all abt trial & error, and to bring out the best performance of each methods used. Can't say for sure which is the best method, as long we are comfortable with one we should stick to it.
Best way is to search for more answers and decide for ourself.
@Intranetusa edit* Also, the main purpose of thermal grease is to actually filing up any micro-gap in the metals of the cpu IHS and heatsinks. Secondly, for better heat conductivity between metals.
BTW, you could mount heatsinks directly onto the cpus WITHOUT any thermal interface and they'll work fine, but I wouldn't recommend so. No harm in trying onto an old rig just to clear any doubt. Make sure u use a temperature monitoring s/w to keep track of the temps.
@geraldlkc using no TIM is a really bad idea. I did a really shitty job at applying mine the first time (bad coverage) and my cpu still shot up from 50 into the high 70's when under load almost instantly. With thermal paste properly applied, it now stays around 40 and gradually increases to 60 maximum. I cant even imagine what would happen with no TIM considering that the heatsink and cpu arent 100% flat.
@srwilli4m No TIM with bad contact will instantly throttle the CPU speed down to about 80% and causing the whole system to hang. For AMD, I'm not too sure but their current gen CPUs should be better.
No TIM but making full contact = quite acceptable and thus idle and load temp will be higher, but won't last for long. CPU throttling occurs and may lead to system hang or BSoD.
Conclusion - Best with a drop of TIM on it or whichever application above works well for individuals.
@WaWaWeeeeeeeWa In fact, this IS a very infomative video for PC techies like us. Unlike you whom doesn't know anything about PC maintainence...so stop trolling.
Although I'm still at the amatuer level of PC maintainence, hence, that doesn't stop me from learning and doing basic overclocking on my own rig. Also that, I could earn a few bucks from friends and clients to keep up with my hobby.
Smile method looked like a bad idea from when I first saw it here... the fact that it took it a while to spread to the center (where the money spot is) proves it.
@lazomaniac not a LOT more, just a little bit more. By the way, you dont have to get 100% coverage of your processor, only the center where a majority of the heat will ofcur
How about a spread + pea method hybrid? First do a spread method and a smaller pea method. I still think the pea method is better but I'm just curious.
Also, will air bubbles in a spread method go out over time???
sorry im new to all this. Im looking to apply some thermal compound to fix ylod on the ps3. If I were to use the pea method, wouldn't I have to let the compound cure or dry? How would I resemble everything if the compounded hasnt spread?
@infinitevisi0n The curing process takes place over a period of time once it's started to spread. There's no way you would just leave it there waiting to cure in a pea shape and then spread it around weeks later. Apply it and re-assemble your PS3.
@infinitevisi0n In short all thermal compounds are made to be ready to work right away. The "curing" prosses is just a time for it to set right and usualy lowers temps by 1-5C extra (looking at the artic silver 5 manual) as for MX-2 I cant seem to find any curing time on their site or from the very short manual for applying it.
hey ca you pls tell me what method will be greatest for my asus F3K laptop. it has amd 64 athlon x2 1.8mhz and ati hd 2600 512 ddr2. i want to replace the paste and dont actualy know what to choose from so many ways whitch onne is better gor me. if any one can advise pls feel free ... thx.. oh and i want to use arctic silver
So your not supposed to put some grease on the chip, then spread it out, then put the heatsink on? (The first thing he did)
The next best thing looks like the pea method, but it doesnt cover the whole chip... seems to me like that is a bigger cpu killer than an air bubble or 2 in the paste...
@xxmoney91xx Why? The cores are the parts that will get hot (middle) so air bubbles is a bigger problem than the thermal past not covering the whole CPU.
It must be better with direct contact between the CPU and the coolingpad and just let the cooling paste be in the pores of the metal. So scraping off the pea with a credit card so you can't see the paste must be better?
what about troll face and forever alone method?
muramasa599 2 days ago
A spread and having it just a LITTLE bit thicker towards the edges should fix what you showed in the picture. It would fill the microgaps at the edges but also have a thin nice coating at the center.
skatterpro 3 days ago
so, the smiley method wins?
Mudux 2 weeks ago
would spread (very thin) then small pea method work?
JRTayl0r 2 weeks ago
ur like, a genius. what do you think of instead of applying it in an x or cross or pea, what about if u applied it as a swirl that way when the heatsink rests on top, it spreads all over? recommended? yes? no? thanks for all your help
NotJoooe 3 weeks ago
I always thought the spread method was the best..........
I am concerned about my cpu and gpu having every inch covered........ help?
NotJoooe 1 month ago in playlist More videos from yaochoon
@NotJoooe re-apply. simple.
GreatIntellect13 3 weeks ago
what method do you recommend for a 2500K with thermalright macho cooler and mx 4 paste? :)
strainjar 1 month ago
@strainjar A Noctua nh c14 cooler with arctic silver 5
GreatIntellect13 3 weeks ago
Also, why are you twisting.... you don't need to do that, and if anything it opens the door for uneven spreading and air bubbles or other mistakes... Just use a pea dot right in the center, and firmly place your heatsink down straight and neat. While securing it, you will move it slightly anyway and that will do the same effect you're doing anyway except not to the degree you're doing it.
staphinfection 1 month ago
The CHIP is right in the CENTER of the CPU, so the pea method is the ONLY method you should ever use. Spreading is retarded and prone to bubbles, mistakes, and makes a mess. Pea method spreads evenly and covers the most important part THE CENTER of the CPU where all the heat will be generated anyway. Don't be a fool, don't spread.
staphinfection 1 month ago 3
@staphinfection I have quadcore cpu and the chip(s) are not at the middle bro
18iser 1 month ago
@18iser yes they are... i.imgur com/7EGJ4.jpg
Jamesey162 1 month ago
@18iser lol The cores are in the middle.
randal0007 1 month ago
smiley method pwns all :)
chrischaf 1 month ago in playlist More videos from yaochoon
The best method is a 5.5mm pea sized dot in the middle of the CPU. Check it out on the IC Diamond website.
summerville22432 1 month ago
@summerville22432 This is about as accurate as I've seen aside from my own calculations. For a .003" (.076 mm) thick layer to be produced that covers most of the CPU cap, a sphere with a diameter of .204" (5.2 mm) needs to be applied to the center. I'm sure there are plenty of variables in there that I didn't account for, but I'm glad to know I got very close to IC's recommendation =)
CelicaMan94 1 month ago
@summerville22432 the best method really depends on what cpu you have
coloreel 1 month ago
every1 look up INDIGO XTREME its better than all these pastes put together. INDIGO XTREME FTW i dropped my temps by 9 degrees and oc an extra 200mhz.
DAVERUKY 1 month ago
smiley method FTW
DAVERUKY 1 month ago
Closer Look = Inverted colors
ericohman 2 months ago
Where do you get such a little transparant plate you use ?
Jaaasperrr 2 months ago
@Jaaasperrr lol... you have to sell your brains to obtain it... /ironic
McWit0 2 months ago
im going without thermal paste and overclocked with stock fan :D my temp is around 70 degrees C when 100% load - is it bad? :D sry for my EN
ktosi11 2 months ago
@ktosi11 it is very bad for the life of the cpu
70 degrees Celsius = 158 degrees Fahrenheit=very hot
i would not recomend no paste as it will greatly shorten the cpu's lifespan when runnning full load
Kingwii1 2 months ago
@ktosi11 yes. lol
DAVERUKY 1 month ago
You know what, there is no need for that method.. its still the same, you put shit on it! And Make it run!
strychnine7777 3 months ago
@snipekill2445 I agree! I've used several different methods in applying thermal paste and I have found that a little paste right in the center of the cpu give you the best results.
Joseph9536 3 months ago
I still prefer the dot method, and even then, with a small quantity oh high density compound, for no one here is considering the heat effect on density.
BTW smiley method, really? xDDD
Excellent videos dude, these do really help
seba3001 4 months ago
As long as you cover the center where most of the heat is coming from (where the CPU(s) actually sit under.
I usually use the spread method really thing with a pea in the middle to avoid bubbles.
flipicaneze 4 months ago
You fucked up the "high 5" method as you call it. Your center dot had way more than the others. If you use a normal amount in the center then it spreads just fine. 5 dot X works best.
hoboX10 4 months ago
Oo the air bubbles come from the bending of the plexi glass surface because you push it down at the corners!
Ganjaseed 4 months ago 6
@Ganjaseed Its glass i don't think its going to bend any time soon. Its because the most of the paste gets to the edge is when it does air bubbles.
ZomgACake 2 weeks ago
:D
TheToppings 4 months ago
Is it enough thermal compound in the pea-method, or should i use more to cover the hole cpu?
Sorry for my bad english
C0rd0n1 4 months ago
This has been flagged as spam show
What is the paper used to spread the Paste called?
SunnyProductiions 4 months ago
Comment removed
SunnyProductiions 4 months ago
so PEA is the best?
DjWhatKid 4 months ago
@DjWhatKid - yes, Pea is the best method, has been for years. Physics rule! :)
smikules 4 months ago
PEE method
FissionTV 4 months ago
Would it be damaging to run the system with excess paste seeping out over the edges like it did with line method?
alphaguitar2 5 months ago
@alphaguitar2 Potentially yes, if your paste is a conductive one (contains metal, for instance)
then shorting can happen, if its non-conductive then it just makes a mess mostly
Moto
Nosoulnomore 4 months ago
@Nosoulnomore Oh duh, makes sense, I did end up buying a silver compound one so hopefully I'm safe, first time doing this. I've already cleaned out my heat-sink and used some Arctic Silver cpu cleaner / purifier and AS5 since my last comment. Temps dropped by 25-30C under load no wonder my system was crashing before when it was peaking at 75C. Couldn't really tell if I spilled any over the edges but hopefully the pea method doesn't come back to bite me :-P
alphaguitar2 4 months ago
I would really like to see a square and one small pea in the center. Preferably with Noctua NT-H1.
Altair8801 5 months ago
The so called "hi five" method looks like some kind of alien sign! Haha! Lol! :p You know, like something taken out of an episode of X-Files! :) Like the pilot episode where these alien abducted teenagers would appear to have two small unidentified marks on their bodies. Hey how about that, a two pea method?!...
Altair8801 5 months ago
Haha! Omg! The smiley method is so funny! :) Watch his eyes and lips swell as the glass plate is pushed against his face! And then he just blows up! *Lolcat* Hilarious!
Altair8801 5 months ago
Nice vid. I have been practicing with different methods and settled with pea. Took some tries to know the proper quantity but well worth it. Was able to squeeze 2-3 degrees down at high load and am running e8500 at stable 3.8ghz with the stock intel cooler.
murka10 5 months ago
@lmax2011
Hey pot, have I introduced you to kettle yet?
kchhoeng 5 months ago
which is the best method people ??
KRAYSLiCK999 5 months ago
Plexiglass is being flexed into a concave shape, trapping air. If it was concave like you're image theory then it would push the air out of the spread method as it's being seated. That said, I'd still have to agree in principle that the pea method has less of a chance of trapping air. I think I'll stick w/ the method of a very thin layer (thinner than what was shown) w/ a pea drop center. It's worked very well for me.
TAZ427COBRA 5 months ago
It is time to redo my thermal paste.... thanks for the video!
Balstar5283 5 months ago
the pee method clearly doesn't cover enough of the cpu to be affective.
siekiersk 6 months ago
... all i have seen here is just people randomly pissing around with thermal paste making "pretty patterns"
grandgranadiers 6 months ago
This video makes all the methods look like shit......so whats the right way to apply? lol
srwilli4m 6 months ago 39
@srwilli4m The cross method seems to be most effiecient.
kenneth1515 3 months ago
@srwilli4m that's the problem. th ere is no right way, especially for playstation 3 owners doing this procedure. computers only radiate heat from the center of the chip, but the ps3 has components under all four corners as well, so all of these techniques fail it including the spread method
DarknessSquall75 3 months ago
@srwilli4m Probably dot method. the silicon chip (the hot part) Is either a 90nm, 45nm, or 32nm chip in dead center of the die.
Dapowerofear 2 months ago
@srwilli4m 2nd (pea) method. It's perfect...
LRoyz 1 month ago
@srwilli4m X method , now shown
memristo 2 weeks ago
crap methods!
its better to use a cuetip and spread it everywhere on the cpu. in this video, all methods just connect the center of the cpu with the heatsink instead of connecting the complete cpu with it!
budojon 6 months ago
@budojon if u read the arctic silver instructions, that's what the manufacturer exactly recommends, no what you are suggesting. and cute-tip rubbing could create static while rubbing thermal compounds :)
marcusdos 6 months ago
no x method?
RickyRecruit 6 months ago
PEA METHOD WINNER xD
Sicari0ne 6 months ago
What would you recommend for HDT coolers
Guitarherotimes5 6 months ago
Best Methods: If you are on coke, use line method. If you're happy, use Smiley method :)
Mightypwee 7 months ago
Anything less than 100% coverage seems wrong. When I popped the heatsink off my Dell, it had 100% coverage with little overflow. Tell me how they did that and how I can do that and then you are getting somewhere useful.
TheLarryBrown 7 months ago
@TheLarryBrown Read the description. He says it's not necessary to go for 100% coverage because most of the heat is focused on the center of the processor. Trying to do so would usually result in some air bubbles throughout the processor. Thus, the Pea method seems to be the best one.
Nettacki 6 months ago
@Nettacki and who is he to say its the right way
siekiersk 6 months ago
This is a good video, the best I've seen on the subject, But I came here to learn "how to do it" and you didn't teach me that. No one on youtube seems to know how to do this properly. If you think you know, you should state up front what is the method you think should be used, then use the alternate methods to prove your point. Don't leave it up to us to make our own conclusions, you should tell us what you think.
TheLarryBrown 7 months ago
Does anybody know what would be the best method for a PS3 using Aritic Silver 5??
CaRBoNWaRPeD 7 months ago
So what's the best method? Is it okay if the whole CPU is not covered in thermal paste??
Andymanse8 7 months ago
@Andymanse8
if the cores are coverd so its ok
lllliiioor123 7 months ago
@lllliiioor123 Where exactly are the cores? I swear it depends on which CPU?
Andymanse8 7 months ago
The smile could use a nose :-)
BullsEye3333 7 months ago
The parallel line method gets the best coverage for regular and heatpipe coolers. Too bad this vid doesn't show it.
thegizmoguy1 8 months ago
@thegizmoguy1 I'd rather not risk having the compound spill out onto the motherboard and short out the CPU, lol.
Haroids 7 months ago
@Haroids As long as you don't use AS5 it can't short anything out.
thegizmoguy1 7 months ago
The smile looks like it is progressively screaming louder as you smash it.
Acsited 8 months ago
Has anybody got any recommendations on which method to use for an AMD Athlon 64 X2 3800?
Also does it matter than not 100% of the CPU is covered?
When applying is it best to move the Heatsink (Coolermaster Hyper TX3 possibly) around like this person is to spread the thermal paste, or just attach it and it will happen?
HD4VBE 8 months ago
Which one is the best method for an i7-990X 6 Core processor using an Arctic Silver 5 thermal paste compound? How is a six processor's cores spread ?
Valsam75 8 months ago
THE SSOONNNNNGGG :OOO
SuperUnic0rn 8 months ago
pea clearly wins
Bonethugs333 8 months ago
@DuddBudda
>Since plexiglass bends
That entirely depends on how big the sheet is, and how thick it is; ever tried snapping a very small twig before?
The plexiglass sheet is pretty small, and it looks extremely thick for something that big; It's doubtful that it'd be bending any more than the metal used on a heatsink.
bluesatin 8 months ago
If it is a dual or quad core CPU then each of the cores are hardly ever just in the centre they are spread out in the corners separated by the control transistors. This means that modern Dual and Quad core CPU's need more coverage further out from the centre.
JackOBytes 9 months ago
Have you ever seen anyone twist their HS that much when they're attaching it? no, you haven't.
Since plexiglass bends, which I'm pretty sure my titan dioesn't the test is not one we can learn from. Sorry.
DuddBudda 9 months ago
@DuddBudda I twist my HSF, thought most people did....
Plexiglass bending will have a very small effect in this test (mostly due to the limited size, try it yourself) and if it did it would of affected the pea method the most which clearly won anyway.
superste2201 8 months ago
But what about after the CPU heats up? Does the paste "melt" and fill in the rest of the gaps?
Dude902 9 months ago
@Dude902 Most thermal compound is designed to retain it's consistency at high temperatures, so no.
ArianolCing 9 months ago
the problem whit the pea is that the chip isn't fully covered why haven't they tried the cross and cross dot
themassau 9 months ago
@themassau Have you ever seen a CPU w/o a IHS on it? The core in the pea method is MORE than covered with tons of excess IHS area covered. If you look at a CPU w/o a intregrated heat sink or IHS...the core is tiny comapred to the IHS. The pea method is logically the best method for MX/AS3-4-5 series TIM's due do there being no air bubbles no excess TIM stuck between the IHS and the heatsink/waterblock because of the high viscosity.
overclockedamd123 9 months ago
well thanks to this vid ive seen the proper way to apply thermal paste......
tazmanian135 10 months ago
where is missionary method?
bsoetoro69 10 months ago 2
I'm going to have nightmares because of that voice.
kchhoeng 10 months ago 80
he has reduced serious stuff to a joke
theAva2000 11 months ago
what if you use the pea method but dont push down that hard
Blimp01 11 months ago
i think pressure has alot to do also, i usually dont mash down on the chip i let the screws/ clamp do that cause you could apply too much pressure and get the dreaded air bubbles and excess paste coming out the side
SuperBrandango 11 months ago
Thank you for taking the time to make this video.
oRedRaider 11 months ago
So basically the pea method would appear to be best? It appears that all I have to do is take the heatsink off, clean off the old paste, reapply new paste via the pea method, and push the heatsink back on.
Correct me if I'm wrong, please, but it seems much simpler than I've made it out to be, haha.
haltrman93 11 months ago
@haltrman93
Unfortunately, the pea method becomes less optimal as more cores start showing up underneath those heat-spreaders if you could tell exactly where each core is located underneath, you could apply a small pea over the location of each core for best heat transfer. I want Intel and AMD to introduce an outline around the location of each core on the heat-spreaders, that would be wonderful.
theminimoose 11 months ago
reason your getting bubbles and what not is becuase your using FAR too much compound. the less the better
blake3443 11 months ago
lol what if the glass just broke in the middle of you pushing it....
fartmonkey200 1 year ago
The pea seems to have the least air bubbles, but it doesn't reach to the corners/sides, so you have chunks of the surface without thermal paste...
Intranetusa 1 year ago
@Intranetusa It doesnt mater since the CPU core is right at the middle.
XwawawaX344 8 months ago
man how mx-2 was wasted in this video?
YOUCANNOTDENY 1 year ago
I use Chuck Norris method, now my CPU is at -16°C idle and -2°C at full load
jonphn 1 year ago
lol
elvispco 1 year ago
This comment has received too many negative votes show
Useless video...
WaWaWeeeeeeeWa 1 year ago
@WaWaWeeeeeeeWa In fact, this IS a very infomative video for PC techies like us. Unlike you whom doesn't know anything about PC maintainence...so stop trolling. Although I'm still at the amatuer level of PC maintainence, hence, that doesn't stop me from learning and doing basic overclocking on my own rig. Also that, I could earn a few bucks from friends and clients to keep up with my hobby.
geraldlkc 1 year ago
@geraldlkc
Is there any way to combine methods? I like the pea/rice grain method but I don't like how the paste doesn't reach the corners and edges of the cpu...
Intranetusa 1 year ago
@Intranetusa Pea/Rice grain methods are the best IMO. Bcoz the main core(s) are mainly located in the mid section of the cpu IHS.
Another way is to use a flexible plastic, like a credit card (preferably VISA or AMEX), to spread it over the entire IHS. Then using the heatsink of ur choice to apply some pressure (as shown in the vid) to get rid of unwanted air bubbles or pockets, b4 securing it. For HDT heatsinks, it's more or less the same.
Search for on "How to apply TIM on HDT heatsinks"
geraldlkc 1 year ago
@geraldlkc
Thanks.
Although I do know how to apply TP. I've just been always using the credit card method, but it seems there will always be bubbles it seems.
I think I'm going to use the pea/grain method, and combine it with the 5 finger method in order to reach the corners too. Basically a large dollop in the middle and 4 smaller dollops on the corner.
Intranetusa 1 year ago
@Intranetusa Both will create tiny air pockets unless u apply some pressure downwards on the heatsink by twisting it left and right b4 clamping it down. This to unsure that 99% of the air pockets between both metals are pushed out. Anyway, this is all abt trial & error, and to bring out the best performance of each methods used. Can't say for sure which is the best method, as long we are comfortable with one we should stick to it.
Best way is to search for more answers and decide for ourself.
geraldlkc 1 year ago
@Intranetusa edit* Also, the main purpose of thermal grease is to actually filing up any micro-gap in the metals of the cpu IHS and heatsinks. Secondly, for better heat conductivity between metals.
BTW, you could mount heatsinks directly onto the cpus WITHOUT any thermal interface and they'll work fine, but I wouldn't recommend so. No harm in trying onto an old rig just to clear any doubt. Make sure u use a temperature monitoring s/w to keep track of the temps.
geraldlkc 1 year ago
@geraldlkc using no TIM is a really bad idea. I did a really shitty job at applying mine the first time (bad coverage) and my cpu still shot up from 50 into the high 70's when under load almost instantly. With thermal paste properly applied, it now stays around 40 and gradually increases to 60 maximum. I cant even imagine what would happen with no TIM considering that the heatsink and cpu arent 100% flat.
srwilli4m 6 months ago
@srwilli4m No TIM with bad contact will instantly throttle the CPU speed down to about 80% and causing the whole system to hang. For AMD, I'm not too sure but their current gen CPUs should be better.
No TIM but making full contact = quite acceptable and thus idle and load temp will be higher, but won't last for long. CPU throttling occurs and may lead to system hang or BSoD.
Conclusion - Best with a drop of TIM on it or whichever application above works well for individuals.
Hope this helps.
geraldlkc 6 months ago
This has been flagged as spam show
@WaWaWeeeeeeeWa In fact, this IS a very infomative video for PC techies like us. Unlike you whom doesn't know anything about PC maintainence...so stop trolling.
Although I'm still at the amatuer level of PC maintainence, hence, that doesn't stop me from learning and doing basic overclocking on my own rig. Also that, I could earn a few bucks from friends and clients to keep up with my hobby.
geraldlkc 1 year ago
Smile method looked like a bad idea from when I first saw it here... the fact that it took it a while to spread to the center (where the money spot is) proves it.
xG33Kx 1 year ago
Somone needs to do a HDT version for he new HDTs on the market.
Skyhanger00 1 year ago
Nice, but the base of a CPU cooler isn't made of glass or plastic... hence this test makes little sense.
SwisssBolla 1 year ago
anyone looks good except spread, just make sure not to put too much
Luger718A1 1 year ago
i dont think x2 was necessary
BLaCkcLAnX 1 year ago
I always use to do an thin X and then a pea in the middle.
ReiMomo 1 year ago
Excellent song choice
phaquetoob 1 year ago
I think I might have applied too much...
CrzayMazy 1 year ago
WHy not penis method? :-D
nikoluka 1 year ago
The Smiley Method changed my life.
reprovo 1 year ago
OK! ..... It's official.......Spread Method
emgee65 1 year ago
if u use a bgger pea,you will cover the whole thing!
irulethe70s 1 year ago
My dual core CPU became an octo core CPU with the smile method :-D
Apathetik666 1 year ago 21
@Apathetik666 looked more like captain exploding-face man method.
alphaguitar2 5 months ago
@alphaguitar2 lol
Apathetik666 5 months ago
My CPU dropped 5C with the smiley method :D
vangstaz 1 year ago 4
Swear when I saw the smiley start spreading it looked like I'M FIRING MAH LAZORZ (aka shoop da woop)
Xuvial 1 year ago
Can you also please add the circle method??
kvitoroulis 1 year ago
but how do you cover the edges, do you just put a lot more?
lazomaniac 1 year ago
@lazomaniac not a LOT more, just a little bit more. By the way, you dont have to get 100% coverage of your processor, only the center where a majority of the heat will ofcur
xkrnbanditx 1 year ago
I use smiley on this pentium4, works great! no jokes
koalabear2 1 year ago
smiley method------IMMA FIRIN MAH LAZARRR!!!!
Dogsofwar909 1 year ago
This has been flagged as spam show
Type in "gift" before youtube in address bar then press enter
nntator85 1 year ago
pea method owns
iLethality 1 year ago 4
I've always used pea, and it seems the best.
MegaHolymoly 1 year ago 4
@MegaHolymoly what do you do about the uncovered edges
hamzie11 1 year ago
@hamzie11 Don't need to worry about it, the cores are in the middle, not the edges. As long as the cores are covered you're good.
MegaHolymoly 1 year ago
What about a double mini-line method?
Naruto0519 1 year ago
Great video, I love the idea.
Also, love how the Smiley method, starts off all happy then appears to be all 'omg I'm being crushed D:'
Miiitchyy 1 year ago 3
How about a spread + pea method hybrid? First do a spread method and a smaller pea method. I still think the pea method is better but I'm just curious.
Also, will air bubbles in a spread method go out over time???
thesisk0 1 year ago
:) to..... 8D
bigchicken24 1 year ago
I'd like to see the spreading using Zalman zm-stg1 grease.
fernandosites 1 year ago
sorry im new to all this. Im looking to apply some thermal compound to fix ylod on the ps3. If I were to use the pea method, wouldn't I have to let the compound cure or dry? How would I resemble everything if the compounded hasnt spread?
infinitevisi0n 1 year ago
@infinitevisi0n The curing process takes place over a period of time once it's started to spread. There's no way you would just leave it there waiting to cure in a pea shape and then spread it around weeks later. Apply it and re-assemble your PS3.
R0CKFISH 1 year ago
@infinitevisi0n In short all thermal compounds are made to be ready to work right away. The "curing" prosses is just a time for it to set right and usualy lowers temps by 1-5C extra (looking at the artic silver 5 manual) as for MX-2 I cant seem to find any curing time on their site or from the very short manual for applying it.
misterz200 1 year ago
vagina method (/)
GibsonsSGFreak 1 year ago
Awesome!
So, my spread method was always wrong xD
Thanks for share this.
It is also recommended to check the specific instructions on the Arctic Silver webpage.
ssdarknight 1 year ago 3
How big is your pea? You say the size is important but it's hard to see from top view
InWeCome 1 year ago
what about and X shape toward the corners of the square of the cpu?
Blue79 1 year ago
2:34 The look on a childs face when he sees something he has wanted for months as he opens it.
MsiEvgaAsusGigabyte 1 year ago
Hi five method is for quad cores im guessing...
MsiEvgaAsusGigabyte 1 year ago
IMO, Hi 5 is the best.
iRawrCats 1 year ago
well, i am now going to use the smile method for now on.
GT5Enthusiast 1 year ago
X is the best ;)
Bigpotatos 1 year ago
Pea method FTW!!
willlewis77 1 year ago
u have alot of compound laying around
13illzz 1 year ago
so air bubbles aren't good...so the first method isn't so good ..??
vagostwo 1 year ago
hey ca you pls tell me what method will be greatest for my asus F3K laptop. it has amd 64 athlon x2 1.8mhz and ati hd 2600 512 ddr2. i want to replace the paste and dont actualy know what to choose from so many ways whitch onne is better gor me. if any one can advise pls feel free ... thx.. oh and i want to use arctic silver
3mariusx 1 year ago
@3mariusx i think that artic silver 5 is by far the best thermal compound and using the smiley method looks the best
blowupuate13 1 year ago
smile method... lol
nickm4207 1 year ago 82
@nickm4207 That's the best, lol. Wait...isn't there a 'lol method' (combo: dot + 2 lines)?
ATDOINFERNO 1 year ago
Pea FTW!
Leonardogfa 1 year ago 63
So your not supposed to put some grease on the chip, then spread it out, then put the heatsink on? (The first thing he did)
The next best thing looks like the pea method, but it doesnt cover the whole chip... seems to me like that is a bigger cpu killer than an air bubble or 2 in the paste...
xxmoney91xx 1 year ago
@xxmoney91xx Why? The cores are the parts that will get hot (middle) so air bubbles is a bigger problem than the thermal past not covering the whole CPU.
zaphr89 1 year ago
@zaphr89 Thanks for clearing that up.
xxmoney91xx 1 year ago
It must be better with direct contact between the CPU and the coolingpad and just let the cooling paste be in the pores of the metal. So scraping off the pea with a credit card so you can't see the paste must be better?
defdac 1 year ago