i think this is not wire bonding process. What i see is dispensing and die bonding process only..there is no wire bonding in this clip.
Dispensing process is where the compound (act like glue) been putting on leadframe/substrate and then die boding process where the machine pick the chips from wafer and place on the leadframe/substrate.
esec if im not mistaken was swiss made? correct me if im wrong..
i am working that filed it is not wire bonding it is LMP die bonding
TheAppu2009 6 days ago
It is not Wire Bonding, it`s Die Bonding !
blenews 10 months ago 7
i need 6 of those... don't know why, but i need them...
exsterenpro 1 year ago
fascinating
lilwhitey0nyx 1 year ago
So to cherish the memory of ESEC die bonder,
I'm nor sure the LOC die bonder whether still to be on active duty for assembly so far?
Thank for ESEC teacher what I had contact as well~
mike16889able 1 year ago
It would be even better if i could make a copy of it's self.
gdykes 1 year ago
Where's the wire bonding? All I see is a machine gluing dies onto a substrate.
S2KFTW 2 years ago
Wow,,, this smokes my Datacon APM2200... I want one!
onefatbass 2 years ago
Men, this is a die bonder machine.
burzum1976 3 years ago
This has been flagged as spam show
i think this is not wire bonding process. What i see is dispensing and die bonding process only..there is no wire bonding in this clip.
Dispensing process is where the compound (act like glue) been putting on leadframe/substrate and then die boding process where the machine pick the chips from wafer and place on the leadframe/substrate.
esec if im not mistaken was swiss made? correct me if im wrong..
iKreeper 3 years ago
Comment removed
iKreeper 3 years ago
That's blazing fast!
chuckshissle 3 years ago